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You will need the Adobe Acrobat Reader to view some of the files below. If you need to install this version of Acrobat Reader, please click this button to download it for free: |
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The following technologies are currently under development: |
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- Optical interconnects and switching are believed to be the key enabling technologies to achieve Terabit per second processing speed in a volume of a few cubic inches
- Irvine Sensors is a Member, University of California at San Diego (UCSD)-led consortium developing a massively parallel, optically switched processor core for computers - a marriage of the electronic densities available with Irvine Sensors' proprietary chip-stacking processes and the speeds which can be realized by optically switching parallel interconnections between such dense structures - expected to permit a breakthrough in processing speed for classes of applications that are presently limited by computer bus architectures. Potential to be a powerful adjunct to
3DANN
- Core technology for:
- Silicon Brain
- High speed Data Communications and Telecom Switches
- A wide range of applications including servers, portable computer systems, cable TV, and fiber optics-to-the- home
EE Times "Stacked-chip Interconnect Makes Board-level Debut"
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Background Information
1 page/(72 kb)
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- Serial data rates to 160 GHz
- Ultra low reconfiguration latency for ATMs
- Super computing via the Internet
- Unique ISC and TRW technologies
- Product potential as an Internet2 enabler
Irvine Sensors Forms High-Speed Router Subsidiary
Irvine Sensors Receives $1M R&D Contract for "Super Switch"
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- Unifying principle is to emulate the human central nervous system
- 3D Field-Effect Transistor (3D-FET) interconnect technology is a key enabling development
- Expected to eventually attain Petaflop performance, i.e., quadrillions of operations per second
- Anticipated to achieve the same volumetric efficiency as the human brain in one-third of a cubic foot (about the size of a shoebox) and using less than ten watts of power
(PDF: 34 KB/ 3 pages)
"Chip Stack Aims for Brain-like Connectivity"
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