Neo-Stack™

• Accommodates a variety of dice in the same stack (4-50 layers) and multiple dice per layer

• Bare stack footprint is the same as largest die, plus 25 mils on all sides

• Easily accommodates die shrinks

Bendable Circuits

• Off-shoot of thinning process for Neo- Stacks

• Thickness: < 50 microns

• Bendable, twistable interconnection between flexible circuits and flexible substrates

• Core technology for wearable bio-monitor and conformal electronics

3DANN™

• 3D Artificial Neural Network (aka "Silicon Neuron")

• High speed, compact image processing and human-level recognition capabilities

• Core technology for VIP/Balboa Image Processing Board, the Silicon Brain initiative, and the SuperRouter development.

• Optical interconnects and switching are believed to be the key enabling technologies to achieve Terabit per second processing speed in a volume of a few cubic inches

• Irvine Sensors is a Member, University of California at San Diego (UCSD)-led consortium developing a massively parallel, optically switched processor core for computers - a marriage of the electronic densities available with Irvine Sensors' proprietary chip-stacking processes and the speeds which can be realized by optically switching parallel interconnections between such dense structures - expected to permit a breakthrough in processing speed for classes of applications that are presently limited by computer bus architectures. Potential to be a powerful adjunct to 3DANN™

• Core technology for:
  - Silicon Brain
  - High speed Data Communications and Telecom Switches
  - A wide range of applications including servers, portable computer systems, cable TV, and fiber optics-to-the- home