High Density Electronic Solutions

Stacked BGA Products

• Accommodates virtually any BGA package stacked within the same outline and footprint

• Memory Types: DDR, DDRII, FLASH, RLDRAMII, Mobile SDRAM - 3D stacked (2 to 4 layers)

• Applications - Server, Portable Electronics, Cell Phone, Notebooks, Digital TV, Wireless, SSR, and Single Board Computers

BGA Stacked SDRAM Data Sheet (PDF)

BGA Stacked DDR SDRAM Data Sheet (PDF)

Stacked TSOP Products

• Economical and accommodates virtually any TSOP

• 3D stacked (2 to 8 layers)

• Applications - Server, Portable Electronics, VME Card,  SODIMM, Memory Modules and Solid State Data Recorder (SSR)

Neo-Stack^TM Technology

For Custom Applications

• Accommodates a variety of different chips stacked (4 to 50 layers)

• Heterogeneous Stack (FLASH, DRAM, ASIC, SRAM)

• Applications - Portable Electronics, Cell Phone, Embedded Systems, Military, Space, Avionics, Wearable Computer

Stacked Bare Die Technology

For Custom Applications

• Memory Types:  DDR, DDRII, FLASH, RLDRAMII-3D stacked (2 to 64 layers) within the single die footprint

• Applications - Cell Phone, Mobile Computing, SODIMM, Military and Space MCM