Irvine Sensors Corporation (ISC) provides complete services for custom 3D stacked products from design, to manufacturing, and to production. ISC is a registered ISO9001:2008 company and all services provided by ISC are USA based. ISC has a complete in-house design team that can migrate existing designs to 3D or take a system requirement specification and perform complete design, including firmware. Examples of previously manufactured 3D stacked cubes and modules are shown in ISC's 3D Stacks Gallery.
ISC’s stacking technology makes possible small, highly integrated, systems-in-a-cube. Layer thinning, T-connects, and passives integration produce final stack sizes less than 1mm in height and footprints not much larger than the bare die. This is an ideal platform for miniature systems and where space is at a premium. Along with reducing volume, other advantages of 3D stacking include minimized electrical parastics for high speed operation, reduced EMI, and integration of heterogeneous IC's and process technologies.
To encompass a broad range of devices, ISC also stacks larger components such as high-powered FPGAs or processors, using area array interconnects. This technology allows for up to 42mm square components with 1000’s of IO. Heat spreader layer technology allows integration of high power parts.
ISC has integrated FPGA’s, QDR, DDR, SDRAM, Flash, microcontrollers, voltage regulators, DSP’s, custom ASICs, passives, sensors, and many other components successfully. ISC’s wide range of custom 3D packaging technologies can support ultra-miniature form factors to large-die/high power modules that operate within rugged environmental conditions.
Where needed, ISC can provide full design services, starting from customer requirements, including prototyping, applying power reduction techniques, developing firmware, testing, generating system specifications, and stacking optimization. By combining extensive capabilities in electrical, mechanical, and process engineering, ISC covers all aspects of stacking design to maximize success.
ISC has delivered multiple successes with ultra-small embedded systems that required power optimization and reduction. This was achieved by combing low power microcontrollers, DSP’s, analog-digital conversion, CMOS imagers, and battery management with optimized firmware. Utilizing a combination of embedded passives, embedded actives, and thinned die, a complete system, including sensors, can be created in a volume less than 250mm3.
ISC provides a wide range of processing services including bumping, thinning, re-distribution metal layers, area interconnects, wire-bonding, flip-chip assembly, underfilling, molding, and, of course, stacking. To maximize system integration, ISC’s Active CapChip Technology can integrate passives and small active components in CSP or bumped die form within the stack. This allows for integration of bypass capacitors, point-of-load regulators, glue logic, etc. in a cost-effective manner. For applications that require minimum height, ISC routinely thins active layers down to 100um.
288Mb QDR memory operational at 333MHz.
Focal plane edge connected to a 2GHz ROIC.
System-in-cube with processor, memory, and glue logic.
Implantable, wireless, stacked bio-electronics.
System with processor stack and memory stacks.
Four layer stacked, packaged memory.
DDR with tamper detection and zeroization.
Up to 4 layer RDL.
Four tier, 3000 pin Virtex FPGAs and DDR.
Focal plane bonded to ROIC stack.
Dual stacked SRAM for space.
Liquid nitrogen cooled stack.
Dual NAND with AT-mesh.
High reliability packaged stacks.
25µm thin, flexible IC's on Kapton™ substrate.
Ultra-high performance memory with integrated heat spreaders.
Modern Class 1000 clean rooms house the equipment necessary to perform thin-film metalization, photolithography, dry (plasma etching, plasma ashing) and wet chemical processes at wafer or multi-chip levels. In-house inspection capabilities include inspection and measurement microscopes, profilometers, wafer and stack test stations, and temperature cycling and burn-in chambers.
Complete manufacturing infrastructure is in place to support die handling, wire-bonding, flip-chip, dicing, and high volume manufacturing, including cost reporting, MRP systems for part tracking, and a ISO 9001:2008 approved quality system.
Various laboratories are dedicated for development and testing of electro optics, electronics, bare die, and cryogenics systems. The IC test laboratory includes computer-controlled probe stations and computerized data acquisition systems to support automated testing of packaged parts down to thinned, bare die. Labs are equipped with optical benches, lasers, spectrum analyzers, and a variety of other analog and digital test electronics.
Stacking capabilities not only for small and low power devices. Projects include a high density processor module with four tiers, each containing one Virtex FPGA and two DDR memory devices, all in bare-die form, with over 3,000 IO. A total dissipated power of 41W is removed with novel cooling techniques developed in partnership with Georgia Tech.
Researching 3D printing techniques to create printed interconnects and stackable layers for rapid stack design and manufacturing. Printed conductive inks down to 350µm pitch with volume resistivty of